Some of Pat’s initiatives were good (stay the course with Xe and fabs, which take a long time to pan out), but they kept delaying everything!
Yet Intel is kind of screwed without good graphics or ML IP.
If they spin off the fabs, I feel like they are really screwed, as they will be left with nothing but shrinking businesses and no multi year efforts to get out of it.
Like… Even theoretically, I dont know what I would do to right Intel as CEO unless they can fix whatever is causing consistent delays, and clearly thats not happening. What is their path?
I think they need to bet the company on regaining their previous lead in actual cutting edge fabrication of semiconductors.
TSMC basically prints money, but the next stage is a new paradigm where TSMC doesn’t necessarily have a built-in advantage. Samsung and Intel are gunning for that top spot with their own technologies in actually manufacturing and packaging chips, hoping to leapfrog TSMC as the industry tries to scale up mass production of chips using backside power and gate all around FETs (GAAFETs).
If Intel 18A doesn’t succeed, the company is done.
So what IS their strategy now?
Some of Pat’s initiatives were good (stay the course with Xe and fabs, which take a long time to pan out), but they kept delaying everything!
Yet Intel is kind of screwed without good graphics or ML IP.
If they spin off the fabs, I feel like they are really screwed, as they will be left with nothing but shrinking businesses and no multi year efforts to get out of it.
Like… Even theoretically, I dont know what I would do to right Intel as CEO unless they can fix whatever is causing consistent delays, and clearly thats not happening. What is their path?
Flail until the light leaves their eyes.
Mmm, I hope the fab survives on their own…
I think they need to bet the company on regaining their previous lead in actual cutting edge fabrication of semiconductors.
TSMC basically prints money, but the next stage is a new paradigm where TSMC doesn’t necessarily have a built-in advantage. Samsung and Intel are gunning for that top spot with their own technologies in actually manufacturing and packaging chips, hoping to leapfrog TSMC as the industry tries to scale up mass production of chips using backside power and gate all around FETs (GAAFETs).
If Intel 18A doesn’t succeed, the company is done.